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TPS54228: Mounting DDA package device to D package land pattern

Part Number: TPS54228

Hi team,

Could you give me comment on following customer question? I assume the datasheet describes the thermal pad of the DDA package (HSOP) must be connected to GND, so the answer is no. If it's possible, could you give me advice on what the customer has to pay attention to?  

Q1. Can DDA package device be mounted to the land pattern of the D package? 

Best regards,

Takeshi Sasaki