Hi, I was wondering what were the layout recommendations regarding the LM73100RPWR chip and thermal vias for two devices in a Priority Power MUX Configuration, with one input 5VDC 1.2A, and the second battery backup, 3.2 VDC at 2.0A ? Should the vias be filled, with conductive epoxy (Very expensive for 6 mil plated over drills)? Is standard 1oz Copper sufficient ? Considering that the device channels are only 12 mils wide this does not allow for many (3) vias (at 6 mils) to be placed on the channel pads.
Any and all Thermal layout guidance is appreciated, thanks 
