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Hi Guys
Customer is using LP5907 with X2SON (DQN) package.
Your datasheet states the following land pattern:
So it’s solder mask defined pads.
However you also refer to SLUA271 stating:
As I understand it the datasheet recommends SMD but generally TI recommends NSMD.
Can you please give me the correct recommendation regarding this?
Thanks
Rodney
Hello,
In general TI would recommend NSMD, but since for the SON package the pitch is small, please follow the datasheet recommendation of SMD. Thanks!
Regards,
Srikanth