BQ25790: BQ25790 thermal performance

Harry Ma

Intellectual 1910 points

Part Number: BQ25790

Hi Team

BQ25790's temperature reached to 133℃ when customers perform thermal simulation. Are there any ways to optimize thermal performance? and can you show how to optimize Layout of BQ25790? Thanks!

over 2 years ago

0 Jeff F over 2 years ago

TI__Guru*** 148835 points

Hi Harry,

The heat is dispersed through PCB copper pours and planes. So, connecting the IC power pins (GND, VBUS, PMID, SYS and BAT) to as much copper as possible on top, bottom and inside layers is the only way to improve thermal performance. I recommend reviewing the BQ25790EVM layout in the user's guide https://www.ti.com/lit/pdf/sluuc51 for guidance.

Regards,

Jeff

Power management

Power management forum

BQ25790: BQ25790 thermal performance