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LM117: LM117

Michael Harmeyer
Prodigy 230 points
Part Number: LM117
Other Parts Discussed in Thread: TPS7A4501-SP

We’re doing a DPA on the parts listed below.  Per MIL-STD-883, TM 2018, SEM is not required for planar die.  Is the die fully planar with no oxide steps?  Are chemical mechanical polish (CMP) processes used?  Or is SEM required?

5962-1222402VHA (TPS7A4501-SP)

5962R9951707VZA (LM117GWRLQMLV)

Thanks,

  • 0
    TI__Mastermind 48695 points

    Hi Michael, 

    I apologize for the delay. I have reached out to try and find this information for you. 

    Because of the upcoming holiday the response may be delayed. Please allow 3-4 business days.

    Thanks,

    Nick

  • 0
    TI__Expert 5176 points

    Michael,

    Both these devices do not have CMP and no oxide steps in the back end. So, they should be fully planar die.

    Thanks,

    Prakash L

  • 0 in reply to Prakash Lakhit
    Prodigy 230 points

    I just noticed that back in 2018 Alex Segler confirmed for us the 5962R1222403VXC (TPS7A4501RHAKGD) was non-planar and required SEM.  Isn't the 5962R1222403VXC similar to the 5962-1222402VHA (TPS7A4501-SP)?  Wouldn't they both be planar or non-planar?

  • 0 in reply to Michael Harmeyer
    TI__Expert 5176 points

    Michael,

    The back end does not have any oxide or CMP. However, I do see oxide deposition post and pre implant. I am guessing that's considered non-planar based on that, apologize for the confusion. Hope that confirms that both 5962R1222403VXC (TPS7A4501RHAKGD) and 5962-1222402VHA (TPS7A4501-SP) are similar. I did confirm that the other device 5962R9951707VZA (LM117GWRLQMLV) does not have any oxide layers.

    Thanks,

    Prakash L