TPS22990: TPS22990N Land Pattern question

Hello Hardy,

I just want to clarify-

1. are you saying you want to reduce the size of the metal to match the solder mask opening?

or

2. are you saying you want to increase the solder mask opening to the size of the metal?

Regards,

Kalin Burnside

Hi Kalin,

It should be 2.

Customer would like to make sure whether we can add solder mask between VIN thermal pad and PAD8-10. So, could we decrease solder mask opening to match metal at NSMD and set metal size same with solder mask opening at SMD?

or

Could we change all pad to NSMD and then set solder mask opening same with metal?

Best regards,

Hardy

Hello Hardy,

We can't match the size of the solder mask opening to the size of the metal pad as this is based on registration tolerances. When the solder mask shifts, the available surface area of the pad will be reduced which will cause solder joint reliability issues.

Can you clarify the exact limitation with the manufacturing process capability that the customer is facing? This will help us address this challenge in next generation packages.

Regards,

Kalin Burnside

Hi Kalin,

Thanks for your reply.

The distance between Pin to Pin needs to be 0.18mm, which is the process capability of the PCB factory.

Best regards,

Hardy