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CSD17308Q3: REACH documentation

Steve Mallien
Prodigy 10 points
Part Number: CSD17308Q3

The REACH status of CSD17308Q3 is listed as "Affected", but I am not able to find any more documentation on this.  The Restricted Chemical Test Results report for this device is limited only to RoHS and does not address REACH restrictions.  Is there any additional documentation that explains what chemical or chemicals are contributing to this component's REACH status?

  • 0
    TI__Mastermind 29755 points

    Hello Steve,

    Thanks for your interest in TI FETs. The CSD17308Q3 uses leaded solder for the internal interconnect to the silicon die. This is common practice for TI and other power MOSFET vendors. You can access the material content for this device under Ordering and quality section in the product folder and clicking on View or download under quality, reliability and packaging information. With regards to REACH affected status on the web:

    • Parts with Pb die attach will show status as Affected.
    • Affected is TI’s interpretation of cases where a REACH SVHC exceeds the threshold defined by REACH, which then obligates TI to notify customers of the presence of that material.  There is no “fail” or “Out of compliance” status for REACH SVHC materials.  REACH SVHC materials are not banned or restricted.

    Below is a link to a technical article explaining which TI FET packages use lead in the interconnect.

    https://e2e.ti.com/blogs_/b/powerhouse/posts/what-does-a-lead-free-power-mosfet-really-mean

    Best Regards,

    John Wallace

    TI FET Applications