Hi Team,
I understand that the difference between Thermal resistance of TL431BQDBZR(Non Q1 grade) and TL431BQDBZRQ1(Q1 grade).
Therefore, I would like to know the reason.
(For example, “Measurement error” etc.)
By the way, I found similar thread of other device.
<Thread comment>
The thermal coefficients were generated at separate times, so our thermal model may have been updated.
In addition, the devices technically have different DIE and maybe have different mold, die-attach,
and bonding options, which can effect the coefficients as well.
The coefficients are dependent on more than just the package itself.
Regards,
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