Hi team,
There are two kind of layout spec for out CSD87381. Could you kindly help to confirm the difference between them? Thanks,
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi team,
There are two kind of layout spec for out CSD87381. Could you kindly help to confirm the difference between them? Thanks,
Hello Ben,
Thanks for the inquiry. I checked with our SMT expert. His response is given below. Please let me know if I can be of any further assistance.
There is only one PCB land pad with two stencil options. Normally customer use 0.1mm thick stencil. Since this device is for power application, some customer may use a thicker stencil for other devices. So we also provide a thicker stencil option with adjusted aperture to compensate for the thicker solder paste.
Best Regards,
John Wallace
TI FET Applications