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UCC27322: PowerPad Inquiry

Cedrick
Expert 8270 points
Part Number: UCC27322
Other Parts Discussed in Thread: UCC27614

Hi,

Good day.

Our customer has a question about the possible alternate for UCC27322. Kindly see below.

I'm using a TI UCC27322 MOSFET driver with a PowerPad.

I understand the PowerPad is electrically connected to the substrate.

My question is; must the PowerPad be electrically grounded to circuit ground or can it be left unconnected.

IC power dissipation is not an issue for my application.


Thank you.

Regards,

Cedrick

  • 0
    TI__Genius 12585 points

    Hi Cendrick,

    Thank you for reaching out!

    I actually just answered the same question yesterday in the following thread: https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1091830/ucc27322-powerpad-connections

    To sum it up real quick, the device will still function with the PowerPad floating, however it is not recommended. 

    All DGN packages of our devices will contain a thermal/PowerPad layer on the bottom of the device. 

    If package size is not an issue, an even better recommendation than UCC27322 is to check out our new UCC27614 single channel low side gate driver in the D package. It is P2P with UCC27322D, but features a higher sink/source current and is much more robust on negative voltage handling on its input pins, and has a much wider VDD operating range than the UCC27322D. The customer could change to the UCC27322D which is larger than our DGN package and does not have the PowerPad underneath, but since adjustments might need to be made to accommodate a new package size, I would recommend going to UCC27614.

    Let me know if you have further questions!

    Thank you,

    Kevin