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TLC5946: Junction to Package TempCo

Brian Angiel
Expert 3550 points
Part Number: TLC5946

I am considering TLC5946 for one of my applications. One piece of data I'm missing is the junction to package temp coefficient--could you please provide this?

Could you also please confirm if the “dissipation ratings” in the datasheet, where it says “operating factor,” is the junction to ambient temp coefficient?

 

The main package of interest is HTSSOP-28 (with PowerPAD) but it would be good to have it for all packages.

It would also be helpful to have the specific PCB footprint heatsink design used to produce the temp coefficients shown.

Thanks,

Brian

  • +1
    TI__Genius 12915 points

    Hi Brian,

    I think the data in TLC5946 is also the package temp coefficient, with a old form since the device is quite old.

    To get junction-to-ambient thermal resistor RθJA, you could use 1 divide the operating factor. For HTSSOP-28 with thermal pad package, it should 1 / 0.03167 = 31.57 °C/W.