Other Parts Discussed in Thread: BQ24610, LM5022
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Hello Vishal,
Is the thermal pad sufficiently connected to the GND plane with thermal vias? On my EVM with ~10 V battery, ~24 V input, and 1 A charge current I see 44.5 C during charging and I see 36.5 C when the battery is not connected.
Regards,
Mike Emanuel
Hi Michael,
The thermal pad of BQ24610 is connected to GND plane using 5 vias. Please refer below layout images for your reference.
Also, what is the expected temperature of BQ24160 for my Design. Input is 24VDC @2.5A from AC Adaptor. Li-Ion Battery pack 12.4V, 2600 mAh. Also, the System output goes to 40V boost converter. The normal current consumption of my design is 200 mA @40V Boost. The battery charging current is set to 1A.
The boost converter circuit of LM5022 is placed on the bottom side of PCB (exactly below the BQ24610 circuit). But there is no heating for LM5022 and the associated components nearby.
The Operating Temperature range for my Handheld Device is 0 to 45 degC. The enclosure is made of plastic. At current room temperature, enclosure is getting heated because of the heating of BQ24610. The End user can feel the heat when he is operating this handheld tool. Therefore, I would like to keep the heating of BQ24160 low i.e. it should be <50 degC when room temperature is 45 degC. How do I solve this issue.
Top Side of PCB
Signal Layer
GND layer and thermal pad for BQ24610
Power Plane
Bottom Side of PCB
Circuit on Bottom side of PCB:
Hello Vishal,
The exact heating of your BQ24610 depends on your GND plane layout and operating power conditions.
As for your circuit you may not have provided a sufficient ground plane. If the circuit on the bottom layer is directly below the BQ24610, you may have heatsinking issues because you only have one GND plane and it is an inner layer. In our EVM the GND plane extends to all layers.
Regards,
Mike Emanuel