TLV755P: Using TLV755P and LP5912 in the same layout

Kaji@PAN

Part Number: TLV755P

Hello,

I am considering using the TLV75533PDRVR and LP5912-3.3DRVR in the same layout.
This is in response to the recent difficulty in obtaining parts.
The packages are the same, and the pinouts are generally compatible.
Can both devices work with the layout shown in the attached image?
In this layout, 3 pin (GND) of the TLV75533PDRVR is not connected, but the datasheet says that Thermal Pad is internally connected to GND, so I think the GND of this device is connected.
In addition, I think that the thermal characteristics will deteriorate because the 3 pin is not connected.

Best regards,

over 1 year ago

0 John Schneider over 1 year ago

TI__Genius 12511 points

Hi Kaji,

As for the thermal pad, I have contacted the packaging team as the Mount Bond diagram was unclear specifically with the thermal pad, I will get back to you when I hear back from them.

Yes the thermal performance will have degradation by the GND pin being floating and not tied to the large GND plane

Regards,

John

0 Kaji@PAN over 1 year ago in reply to John Schneider

Mastermind 7145 points

Thank you for your reply.
Regarding the thermal pad, I will wait for your reply.

Best regards,

0 Kaji@PAN over 1 year ago in reply to Kaji@PAN

Mastermind 7145 points

Were you able to confirm information about the thermal pad?
Best regards,

0 John Schneider over 1 year ago in reply to Kaji@PAN

TI__Genius 12511 points

Hi Kaji,

The packaging engineers got back to me. Unfortunately he said that the thermal pad is a separate GND from the device ground. This means that you would need to place a 0 ohm jumper from pin 3 to the thermal pad. I'm talking to design to see if there is another way or if the connection is different from what packaging says. I will update you if I hear back.

Regards,

John

0 Kaji@PAN over 1 year ago in reply to John Schneider

Mastermind 7145 points

Thank you for your reply.
I will wait for an update from you.
Best regards,

0 Kaji@PAN over 1 year ago in reply to Kaji@PAN

Mastermind 7145 points

It's been a week since our last exchange, can you update the information?
Best regards,

0 Nick Butts over 1 year ago in reply to Kaji@PAN

TI__Mastermind 40825 points

Hi Kaji,

John is OoO until tomorrow. He will get back to you when he returns.

Regards,

Nick

+1 John Schneider over 1 year ago in reply to Nick Butts

TI__Genius 12511 points

Hi Kaji,

Sorry for not pushing the update to you!

I spoke with a senior engineer and they informed me that it is a loose connection through a conductive die attach. What this means is that in order to get good performance out of the part, you should tie a jumper to the actual GND pin of the device, otherwise there will be problems with the high and variable impedance that a conductive die attach adds to the effective ground of the device. It is tied to GND to assure that the bulk of the die is not floating, but it is through a non-zero impedance that can end up being very high effective impedance, so the recommendation would be to tie a 0Ohm jumper to GND.

Regards,

John

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TLV755P: Using TLV755P and LP5912 in the same layout