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PTH08T240F: Thermal Management - Heat SInk/Pedestal Requirement

Part Number: PTH08T240F

Hello All,

We have used PTH08T240FAD IC in our board. Now, we were creating mechanical enclosure to the Board. Heat Sink/Pedestal planning to this component needs to be done.

On the top side of the Power Module, we can observe two ICs , Inductor and 2 capacitors. 

Can you please suggest a good way of providing the heatsink/Pedestal to the power module. We want to operate the module at 71C ambient temperature.

Should we plan to provide a small pedestal for Inductors and two ICs? Please let me know.

  • Hi Sagar,

     

    There's multiple methods to consider when wanting to improve heat dissipation for a device. Key items include the size of the board, adding thermal vias, thicker copper planes, avoiding breaking the thermal path and as mentioned, adding heat sinks. For more details on each please see app note: https://www.ti.com/lit/an/snva419c/snva419c.pdf

     

    Referring to the heat sinks for this device, you can do the IC's as this will be the main source of heat (Refer to section 3.5 of the App note above for Heatsink section). If possible consider placing the heat sink on the bottom of the board as it's connected in series with the low thermal impedance of the exposed pad making the heat sink more effective, else you can connected it at top, but it may be less effective due to the plastic top high thermal impedance.

     

    When mounting the heatsink there may be an air gap in between for which you can use thermal grease/Thermstrate, when insulation from heatsink is NOT required. If insulation from heatsink is required use a thermally conductive, but electrically insulated pad, such as a Sil-pad. Other considerations to account for is making sure the heat sink is rigidly connected to the IC or else it could cause stresses/strains on designs subject to heavy vibrations.

     

    Regards,

    Eileen