• State TI Thinks Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 2 answers
  • Subscribers 63 subscribers
  • Views 141 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LMG3422EVM-043: Dimension of thermal pad and thermal via

Charles Zhang1
Intellectual 2970 points
Part Number: LMG3422EVM-043

Hi Team,

Could you share the thermal design detail of LMG3422EVM-043? Includes TI GaN's PCB thermal pad size(dimension) and PCB thermal via size(dimension). 

My customer would like to leverage the similar design to theirs.

Regards,

Charles

  • 0
    TI__Intellectual 1840 points

    Hello,

    Thank you for reaching out, please give me some time to respond properly to your question. I will talk with my team and give you an answer tomorrow, I will let you know if I need any more details from you.

    Thanks,

    Zach

  • 0 in reply to Zachary Soviero
    TI__Intellectual 1840 points

    Update:

    For our LMG3422EVM-043, we use the same thermal pad size and thermal vias that are in the mechanical information of the LMG342xR030 datasheet.

    Please see section 14 of the following datasheet link for all dimensions:

    https://www.ti.com/lit/gpn/lmg3422r030 

    One thing to note: in the EVM you referenced, some of the thermal vias on the low-side device are not placed. This is done intentionally to provide a return path for current to flow beneath the device in a signal layer which minimizes parasitic inductances. If you'd like more information about this please let me know and I can elaborate.

    Regards,

    Zach