TPSM82810: reflow

Hi Nishie,

This app note, from the product page, should answer many manufacturing questions: https://www.ti.com/lit/ug/slib006a/slib006a.pdf This device just needs standard reflow.

This other app note, also from the product page, discusses the thermal improvement that occurs with vias and other techniques: https://www.ti.com/lit/an/slyt724/slyt724.pdf 

Thanks,

Chris

Hi Nishie-san,

The app note was for both rework and the initial assembly.  Section 4 talks about the first assembly/reflow:

4 Surface Mount Assembly

Surface mounting of MicroSiP BGA and LGA packages is broadly similar to BGA and QFN package assembly, respectively. TI recommends the use of lead-free solder paste applied via a 0.1-mm thick stencil. The paste acts to aid wetting of the MicroSiP pin to the board land pad, to hold the device in place during reflow, and to contribute metal volume of the resultant solder joint. For the setup of a reflow profile, the JEDEC reflow profiles for near-eutectic SnAgCu solder alloys can be used as a starting point with soldering temperatures up to 250°C.

This app note discusses reflow profile details: https://www.ti.com/lit/an/slua271b/slua271b.pdf

Chris