CSD17484F4: Junction-to-case thermal resistance (Rjc) for CSD17484F4

Hello Kiran,

Thanks for your interest in TI FETs. The CSD17484F4 is a chip scale device. Essentially, a silicon chip with solderable, metallized LGA pads. There is no lead frame, bond wires or plastic overmolding. Therefore, we do not spec Rθjc in datasheet since case and junction are very nearly the same temperature. There should be very little difference in temperature measured on the surface of the device and the junction temperature. Please let me know if you have any additional questions.

Best Regards,

John Wallace

TI FET Applications