This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

LM2675: Why the internal structures are different in same lot?

Part Number: LM2675

We purchased LM2675N-5.0/NOPB and send them tested for X-ray. 

the testing results showed that 85pcs parts have the same structure and 15pcs have totally opposite leads and die structure.

but both of them works fine according to the datasheet. My question is that possible to happen on TI's product?

  • Hi Sato-san,

    Thank you for posting.  The top marking picture shows National Semiconductor logo.  As an Apps engineer, I cannot tell what exactly happened. What I can tell is, the lead frame seems being updated/changed, most probably due to the change of the assembly house, or material availability, or some other justifiable reasons. The IC is subject to such changes without notice.  As long as it is authentic TI products, the performances are guaranteed by the datasheet specifications, and they should be considered the same product.

    Hope this clarifies.

    Best Regards,

    Youhao

  • Hi Sato-san,

    May I assume the issue is resolved so I can close the thread here?  You are always welcome to re-open it by adding a new post.

    Best Regards,

    Youhao