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TPS1HB08-Q1: We are experiencing desoldering issues with the component TPS1HB08FQPWPRQ1

Juan Jose Jimenez Escobedo
Prodigy 10 points
Part Number: TPS1HB08-Q1

We are validating a new application at our location. with this particular component we are experiencing desoldering issues. one of the things that we are observing are solder voids between the thermal pad(exposed pad) and the thermal land. not sure if you guys have some sort of a guide that may help us on mitigating this particular effect. or maybe the voids are normal for this type of packgage? 

  • 0
    TI__Mastermind 32650 points

    Hi Juan,

    For this device, the power supply is through the thermal pad. A lot of the internals of the device depend on good solder connection between the device and the PCB. Solder voids are to be avoided as much as possible to maintain good connection and expected operation of the device. 

    This application note has some suggested solder profiles for the package: https://www.ti.com/lit/an/slma002h/slma002h.pdf 

    If the reflow profile change does not work, please email me directly at s-dmello@ti.com. It would also be good to know if you have had issues soldering any other TI high side switch device.

    Thanks,

    Shreyas