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TPS7B81-Q1: package spec/ design requirements

Zena Lee
Intellectual 2700 points
Part Number: TPS7B81-Q1
Other Parts Discussed in Thread: TPS7B87-Q1

Hi team,

Customer is considering moving from KVU package to DRV in TPS7B8750-Q1, using under 20mA as load current. 

Could you give feedback for this?

1. Are there any other spec difference other than thermal data in two packages?

2. Are there additional design requirement needed for schematic/ layout etc? Package size seems to differ much.

3. Do we have sample board with DRV package?

  • 0
    TI__Intellectual 1730 points

    Hey Zena,

    Customer certainly can move to TPS7B81-Q1 device to use 2x2mm DRV package.

    There are performance difference between TPS7B81-Q1 and TPS7B87-Q1. I have listed them here:

    2. No other specific requirement are needed. Customer only need to design board for DRV package.

    3. You can review this generic board design for this DRV package:

    https://www.ti.com/tool/MULTIPKGLDOEVM-823

    Regards,

    Rohit Phogat

  • 0 in reply to Rohit Phogat1
    TI__Intellectual 2700 points

    Sorry for the confusion. TPS8750-Q1 was typo.

    Customer is moving from KVU to DRV, but with same part, TPS7B81-Q1.

    Could you answer these question again? Thanks. 

    1. Are there any other spec difference other than thermal data in two packages?

    2. Are there additional design requirement needed for schematic/ layout etc? Package size seems to differ much.

    3. Do we have sample board with DRV package

  • 0 in reply to Zena Lee
    TI__Intellectual 1730 points

    Hey Zena,

    Here are the details:

    1. No, apart from thermal difference, there is no spec difference. The spec variation in EC table presented in datasheet, includes all of the packages.

    2. No, customer only need to re-design the board for DRV package and plan for thermal vias to connect the thermal plane of package to GND for better thermal performance.

    3. The generic EVM board for DRV package is here:

    https://www.ti.com/tool/MULTIPKGLDOEVM-823

    Regards,
    Rohit Phogat