UCC27424: Exposed of bonded wire and anomaly on solder pad.

Calvin Goh

Part Number: UCC27424

We have recently bought 22,500pcs of UCC27424DGNR with DC2229 and DC2231. As we were doing checks prior to mounting on our PCB boards, our QC team observed exposed of bonded wire seen on top of the package as well as anomaly on solder pad (Mold resin).

Could you please help check and advise if below photo presented as observed exposed of bonded wire seen on top of the package as well as anomaly on solder pad (Mold resin) can meet TI standard on the condition the parts pass soldering, X-Ray, Decap testing?

Thanks

Calvin

7 months ago

0 Rubas Khalid 7 months ago

TI__Expert 5515 points

Hi Calvin,

Thank you for providing the pictures. I am currently looking into this issue and will get back to you in the next couple days.

Thanks,
Rubas

+1 Rubas Khalid 7 months ago in reply to Rubas Khalid

TI__Expert 5515 points

Hi Calvin,

Thanks for your patience. I have received info that the anomaly on the top of the package could possibly be exposed metal, but it is not clear enough to identify for sure. If possible, can you send pictures that are closer up and clearer of that mark circled in red in your second picture?

That part should have not passed, so it most likely went through by mistake. The anomaly on the solder is pad shouldn't be a concern, though.

Thanks,
Rubas

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UCC27424: Exposed of bonded wire and anomaly on solder pad.