Other Parts Discussed in Thread: TPSM63606,
Section 6.4 (Thermal Information) of the December 2023 datasheet only lists two metrics for the package/device thermal information.
Datasheets for other devices (e.g. TPSM63606) in this series also list a Junction-to-Top Characterization parameter which is very useful when evaluating/simulating the use of the device.
Can the factory please provide additional thermal metrics and information for the TPSM64406 and its RCH/QFN-FCMOD package?
Specifically, I would like the Junction-to-top characterization parameter.
Thank you.
Regards,
M