TPSM64406: Request For Additional Thermal Characterization Parameters

Hello,

Let me look into that with the systems engineer and get back to you by EOB Monday (2/26 PST). 

Regards,

Jimmy

Hi M,

It is possible, but may take a bit of additional time (2-3 weeks).

For now, you may use the infrared thermal images in the application's section of the datasheet to estimate thermal performance.

Thanks,

Richard

Richard -

Is it valid to assume that the Junction-to-top on this device comes close to other devices in the family using a QFN-FCMOD type of package?

While waiting for a characterization over the next few weeks, is there a package the factory can point me to that would have similar junction-to-top performance?

How about the simulated/expected performance?  I realize the simulated number may be somewhat different than the final experimental found in lab characterization - even a simulated number that might be 10-20% off the final would be adequate for my preliminary investigations.

For the short-term, I am just wanting to know if the expected junction-to-top performance is similar to the listed junction-to-board at ~5C/W or much (4-5x) worse?

Please advise.

Thanks,

M

Hello M,

I am checking with the internal team to see where the other thermal parameters are.

Usually these parameters are simulated following JEDEC standards and published on datasheet as you've previously mentioned.

I think there might be some filtering function that took those value off the existing datasheet so I need to look into it with the team.

Hope to get back to you by the 28th of this week.

Regards,

Jimmy