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TPS7B86-Q1: Package info confirmation about TPS7B8633QDDARQ1

Shuang Feng76
Expert 3020 points
Part Number: TPS7B86-Q1

Hi Team,

     Could you please help to check how to choose the right package info of TPS7B8633QDDARQ1?

     As we could see two DDA package info. the thermal pad info is different. How could we to cinfirm the right package info?

     Hope for your comments.

  • 0
    TI__Expert 3650 points

    Hi Shuang,

    There are two different package drawings of the HSOIC-8 package because there are two different leadframes that could be used, depending on which version of the device is ordered.

    The correct package drawing for TPS7B8633QDDARQ1 at this point corresponds to the drawing labeled "DDA (R-PDSO-G8)."

    Regards,

    Kelsey

  • 0 in reply to Kelsey Farr
    TI__Expert 3020 points

    Hi Kelsey,

        Thanks for confirmation.

        Could you please share how to identify the right DDA according to full part number?

        I did not find related info in datasheet. Hope for your sharing. 

  • 0 in reply to Shuang Feng76
    TI__Expert 3650 points

    Hi Shuang,

    This is a good question, and I'm following up with the team in charge of this to see if we can add some sort of indicator of which leadframe is relevant to which corresponding OPNs. I had to check our internal assembly system to determine which thermal pad was the correct one, and since you don't have that ability, I'm seeing what can be done to make it easy to tell just by looking at the datasheet.

    The difference in leadframe is sourcing dependent, so I'm not able to give a rule of thumb for which OPNs are which leadframe right now. But I will let you know feedback from our product engineering team about how we plan to add that info to the datasheet.

    Regards,

    Kelsey

  • 0 in reply to Kelsey Farr
    TI__Expert 3650 points

    Hi Shuang,

    We will be updating TPS7B86-Q1's datasheet to include only one package drawing of the HSOIC-8 package. The updated package drawing will include thermal pad dimensions and tolerances that will allow for design with both leadframe variants. That way, any TPS7B86-Q1 device in the DDA package will be thermal pad footprint compatible, as it should be.

    I would expect the new package drawing to be live in the datasheet within 3 weeks.

    Regards,

    Kelsey