LM3508: Question about BGA package structure.

Kazuya Nakai59

Guru 20400 points

Part Number: LM3508

Hello guys,

One of my customers is going to use LM3805 for their new products.

At this moment, they have the following questions.
Could you give me your reply.

Q1.
Their 1'st question is same as the following E2E.
https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/285576/about-the-package-bga-ball-size-of-tmp006

What is the substrate diameter (180um in case of the E2E above) of LM3508 BGA package?
Is it same as the E2E, 180um?

Q2.
Is the solder resist for LM3805 solder ball portion a over resist structure? Or normal resist structure?

Your reply would be much appreciated.

Best regards,
Kazuya.

4 months ago

0 Patrick Yao 4 months ago

TI__Mastermind 22840 points

Hi Kazuya,

Please allow me some time to check these information. Will keep you updated.

Patrick

0 Kazuya Nakai59 4 months ago in reply to Patrick Yao

Guru 20400 points

Hi Patrick,

Thank you very much for your reply.

I'm looking forward to receiving your updated.

Thank you again and best regards,
Kazuya.

0 Patrick Yao 4 months ago in reply to Kazuya Nakai59

TI__Mastermind 22840 points

Hi Kazuya,

I found below information. For question 2, could you please give us a detailed explanation? Thanks

Patrick

0 Kazuya Nakai59 4 months ago in reply to Patrick Yao

Guru 20400 points

Hi Patrick,

They want to know whether LM3805 solder mask (red arrow portion) overlaps on PAD which the solder ball attached like this picture or not.

Thank you very much and best regards,
Kazuya.

0 Patrick Yao 4 months ago in reply to Kazuya Nakai59

TI__Mastermind 22840 points

Hi Kazuya,

OK, I will check again.

Patrick

0 Patrick Yao 3 months ago in reply to Kazuya Nakai59

TI__Mastermind 22840 points

Hi Kazuya,

Unfortunately we didn't find this information yet. May I know if this is mandatory for your design? We may need another workaround.

Patrick

0 Kazuya Nakai59 3 months ago in reply to Patrick Yao

Guru 20400 points

Hi Patrick,

Thank you very much for your supports.

The data is mandatory. But if TI doesn't have such data, the customer will try to measure and check it with micrometer and eyes.
However TI official data will help their soldering very much.

So if you get the data even though it take a time, could you please let me know? They need the data.

Thank you again and best regards,
Kazuya.

0 Patrick Yao 3 months ago in reply to Kazuya Nakai59

TI__Mastermind 22840 points

Hi Kazuya,

I will check with our layout colleague if they have such data.

Patrick

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LM3508: Question about BGA package structure.