LMZ23608: Common Failure Modes

Hello Adam,

Please answer the following probing questions below:

• Is this a new design or is it a redesign? Please provide a schematic and PCB  layout for me to review.
• On the PCB, can you confirm that the LMZ23608 had sufficient solder? If there isn't enough solder the part will get hot.
• What is the power conditions of your application (VIN,VOUT,FSW,IOUT)?
• How many failures have you experienced and is there permanent damage to the board or just the IC?

Regards,

Jimmy

Hello Jimmy,

• It's not new or a redesign. I cannot provide the schematic and PCB layout due to the nature of it's application (proprietary).
• Visually it appears to have had enough solder.  
• Vin=24 Vout=1.8V Iout=6A Max
• This is the only failure I am aware of that has resulted in this kind of event. There is permanent damage to the Board. 

Would you be able to provide me environmental tests that have been done to this item? 

Do you have a list of common failure modes? 

Can we move this conversation to a private email chain? 

Thank you,

Adam

Hello Adam,

Do you have an assigned field sales engineer to your company that you can relay the information to?

We can take this offline but I just want to make sure to include an TI contacts if you have any in that email chain for troubleshoot and debugging.

Regards,

Jimmy

Hello Jimmy,

Unfortunately, I do not at this time. I've been trying to reach out for support with no responses yet. 

Thank you,

Adam  

The responsible engineer is out of office now and TI responses may be delayed. Thank you for your patience.
-EL

Hello Adam,

I've included Ryan for continued support.

Regards,

Jimmy