TPS2H160-Q1: The IC is burning under specific circumstances

Nuri Seko

Prodigy 150 points

Part Number: TPS2H160-Q1

Hello TI support team,

I'm writting this support request as our IC "TPS2H160-Q1" is burning under a test circumstance.

The conditions for the IC are as follows:

IN1 - Float(Weak Pull down)

IN2 - Float(Weak Pull down)

OUT1 - short to GND

GND - 2.8V

VS - 32V

NC - GND

THER - GND

We have tried all reverse current protection circuitries(Diode towards VS pin, Diode towards GND, Diode Towards load). We still get the issue.

The condition where we get the issue is when the "Load" isn't connected(it is open).

The damage causes VS, OUT1, OUT2, and GND to be shorted together.

Please support with a suggestion for a possible protection.

Thank you in advance,

Nuri

3 months ago

0 Elizabeth Higgins 3 months ago

TI__Genius 15540 points

Hi Nuri,

Could you clarify whether the issue is when Vout is connected to GND or floating?

What is causing the GND pin to see 2.8V?

Is occurring on all boards and devices tested? Have you put a known good unit on a known good board and ran this test and seen this result?

What I am expecting is some sort of electrical overstress event. Please ensure the device is operating within the ratings below:

Best Regards,

Elizabeth

0 Elizabeth Higgins 3 months ago in reply to Elizabeth Higgins

TI__Genius 15540 points

Do note, our short to ground test is for 12V to satisfy AEC-Q100-012, not 32V.

More information on this test and our short-circuit reliability can be found in this app note: https://www.ti.com/lit/an/slva709a/slva709a.pdf?ts=1716474369231

Best Regards,

Elizabeth

0 Nuri Seko 2 months ago in reply to Elizabeth Higgins

Prodigy 150 points

Hello Elizabeth,

VOUT is connected to GND.

The source of the 2.8V is still unknown.

I believe the issue is that we have a voltage on GND, and the "INx" pins of the switch are conneced to the GND via a weak pull down, so when GND is applied to one of the Vout, we're getting an "Activation" condition for 1 of the VOUTs.

0 Nuri Seko 2 months ago in reply to Elizabeth Higgins

Prodigy 150 points

Hello Elizabeth,

Thank you for the information!

I have a question about the DAP of this IC: is it connected to the GND of the IC? Meaning, can current flow through the DAP to the GND of the IC(if a certain level of voltage is present on the DAP).

Thank you in advance,

Nuri

0 Elizabeth Higgins 2 months ago in reply to Nuri Seko

TI__Genius 15540 points

Hi Nuri,

Thanks for your patience while I was out of town. What do you mean by the DAP? Do you mean the thermal pad of the device?

The thermal pad can be connected to ground or left floating. We do not recommend to tie that node to any other potential.

Best Regards,

Elizabeth

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TPS2H160-Q1: The IC is burning under specific circumstances