Tool/software:
Hi Team,
I notice the package info in TPS65320D-Q1 datasheet is inconsistent.
1st page shows HTSSOP but the bottom shows TSSOP and it also have 2 different package info, one is PWP0014G, the other one is PWP0014K.
My questions are:
1. Whether we should be that package info even it marked as TSSOP and which one should we refer to? "G" or "K"?
2. What is the main difference between "PWP0014G" & "PWP0014K"?
Looking forward to your reply.
Thank you.
Hi Evan,
I believe the datasheet is still correct. The H stands for Heat-sink, and TSSOP stands for Thin Shrink Small Outline Package. The difference between them is that the HTSSOP has an exposed thermal pad, but it is still a Thin Shrink Small Outline Package. These sections show this exposed thermal pad in the physical drawing diagrams.
Here is device, linked here, that is TSSOP alone and not HTSSOP, you will notice that there is no exposed thermal pad at the bottom.
In regards to the G and K, it appears the difference is that this exposed thermal pad has more area on the K version, and a smaller pin 1 index area.
Here is the G version:
Here is the K version:
Thanks,
Field
