PTH03000W: Backing condition for PTH03000WAZ

pradip yejare

Prodigy 20 points

Part Number: PTH03000W

Tool/software:

Hi TI Team,

Need you help to share backing condition for MPN PTH03000WAZ.

BatchNo

Comments

PartNo

VenderNo

Vendername

MFG

MPN

Qty

OrderNo

issuecategory

issuedetail

BuyerName

Location

BT1372568

GEC1H-5315744

SPZU15030

Texas Instruments China Sales Limited

TEXAS INSTRUMENTS

PTH03000WAZ

11AK05056

No MSD package

FIFO MSL:3;
VENDOR MSL:3

GSS-PSS-Pradip Yejare

Suhong

2 months ago

0 Chris Glaser 2 months ago

TI__Guru*** 145080 points

Hi,

I don't understand what 'backing condition' is. Can you rephrase what information you need?

Thanks,

Chris

0 pradip yejare 2 months ago in reply to Chris Glaser

Prodigy 20 points

I mean baking condition or requirement for PTH03000WAZ

0 Chris Glaser 2 months ago in reply to pradip yejare

TI__Guru*** 145080 points

These are MSL-3 level devices. I believe that's the information your assembly line should need.

Chris

0 pradip yejare 2 months ago in reply to Chris Glaser

Prodigy 20 points

actually, i need what temperature and how many hours baking required.

eg. as below.

0 Yann Ducommun 2 months ago in reply to pradip yejare

TI__Expert 3215 points

Hi Pradip,

I will take this thread over after discussion with Chris.

Firstly, please note that in general baking is not required as long as products have been properly stored.

However, in case floor life time is exceeded (168hrs for MSL3) or the humidity indicator card indicates excessive moisture, baking is required prior to the reflow process in order to remove any moisture out of the plastic package.

For this, please use baking parameters according to Table 5 (as per IPC-JEDEC J-STD-033) from document below:

https://www.ti.com/lit/an/snoa550h/snoa550h.pdf

using body thickness > 2.0mm.

Please get back to me in case anything is unclear.

Thanks!

Yann

Power management

Power management forum

PTH03000W: Backing condition for PTH03000WAZ