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Tool/software:
Hi,
My customer is asking about following change for your datasheet of TPS56220x.
* We have three points.
1. Why did you change "Fsw" conditon from "Vin=12V, Vo = 1.05V, FCCM mode" to "Vin=12V, Vo=3.3V, Io=1A" in datasheet Rev D ?
2. Why did you change some figures which is described in section 5.6 in datasheet Rev D ?
3. Why did you change sentence of section "Normal operation" in datasheet Rev D ?
Is it affection of FAB change ?
BR,
Hi Guru,
This was a design change, we improved the low drop-out performance which may cause freq drop at low Vin condition.
Hi,
Thank you for your reply.
So, are the chips which were shipped under datasheet Rev A and the chips which were shipped under datasheet Rev D different ?
BR,
Hi,
I would like to ask an additional question..
PCN20240430000.1 for the process change says the following.
Die Rev:
Current New
A A
Is this incorrect and is New Die Rev = D correct?
BR,
Hi,
The Data sheet revision D is different thing from Die version, the new Die version A means it's the first released version with new design, data sheet was updated to RevD to reflect the die changes
Hi,
Thank you for your reply.
Is the following understanding correct?
- A new die with Process LBC9 was added in PCN20240430000.1.
- The new die with Process LBC9 also has a Die Rev of A.
- Therefore, the following two types of dies are registered.
# Fab Process Die Rev
1 MIHO8&RFAB LBC7 A Current
2 RFAB LBC9 A Additional
- The datasheet change in Notification# 20241014000.0 is due to the addition of a new die with Process LBC9.
BR,