Hi,
Now I'm referring the PCB layout of LMZ35003EVM-001 that has Layer 2 as AGND plane and Layer 3 & 4 as PGND. But now our customer can prepare only inter PGND. Then which do you recommend that top AGND should connect to inter PGND with via or top AGND should not connect with via? I understand that it should be connected to improve thermal performance, but I'm concerning the impact of switching noise from PGND to AGND.
Best Regards,
Satoshi / Japan Disty