TPS84250: THERMAL PROPERTIES

yanir hoota

Part Number: TPS84250

First of all - I know that there's a new part number - LMZ35003RKGT

In the data sheet - in the 'thermal information' section there are some properties:

junction-to-ambient thermal resistance (θ JA)
junction-to-top characterization parameter (Ψ JT)
junctions-to-board characterization parameter (Ψ JB)

I would like to have the thermal resistance from junction to top (θ JT) , as well as from junction-to-board (θ JB) (with specific board, or at least junction-to-bottom)

If there's no information about it:

I would like to know exactly which test board you used while measuring the Ψ JT and Ψ JB (1s, 2s2p, etc)

Thanks

over 6 years ago

0 J Arrigo over 6 years ago

TI__Mastermind 28020 points

We do not supply the Θ JT and Θ JB for most of our power modules, especially our larger devices. The multiple internal components affect the accuracy of the parameter.

The Ψ JT and Ψ JB parameters where measured on our EVM for the device. For this device you can find the board layers in the user's guide for the LMZ35003EVM .

0 yanir hoota over 6 years ago in reply to J Arrigo

Prodigy 30 points

Thanks for your response.

Ive reviewed this user's guide and in page 9 it is written:

PCB, FR4 0.062 inch, 1 oz copper all layers.

But I didn't understand how many copper layers there are.

0 yanir hoota over 6 years ago in reply to J Arrigo

Prodigy 30 points

And it also unclear if its only 1 oz copper for all the layers together or 1 oz for eaxh layer (and then I have the previous question of how many copper layers there are)

Thanks
Yanir

0 J Arrigo over 6 years ago in reply to yanir hoota

TI__Mastermind 28020 points

This board has 4 copper layers (see pages 6-8 in the user's guide). Each layer is 1 oz copper thickness.

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TPS84250: THERMAL PROPERTIES