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TLV62585EVM-824: TLV62585

Part Number: TLV62585EVM-824

Hi

 

 

As board layout section inside “SLVUB03”, there seems to be intentionally GND connection in different layers

 

 

GND pouring is clear in Fig 3 – internal layer 1, but Fig 4 and Fig 5 the pouring intentionally kept clearance

 

What is the purpose for?

Should I follow the recommendation or any convenient way to pouring else?

 

Thanks

 

Regards

Ben