A related question is a question created from another question. When the related question is created, it will be automatically linked to the original question.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
LP5907: LP5907 - Thermal vs package in X2SON and DSBGA
Could you clarify which thermal specification and which DSBGA you are looking at?
Thermal performance is dependent on many variables including board layout, type of package, die size, die orientation and location within the package, mold compound, etc. Since you are using the thermal information table from the datasheet we know that both specifications are from a JEDEC High-K board and the die is the same for both metrics; however, there are still many variables that will impact the thermal performance for the given package.
Hi Ryan,
Thanks for your reply. We just want to know why the thermal resistance in X2SON package is higher than DSBGA package.
As I know, with thermal pad package could provide lower thermal resistance in juntion to bottom.
I refer to LP5907 datasheet in 6.4 section in p.6.
The DSBGA package just covers the top surface of the die. As a result, the thermal resistance from junction to the bottom only comes from the silicon itself which is highly thermally conductive. This results in a low thermal resistance.
The X2SON package has a mold compound between the junction and the case. The mold compound is not as thermally conductive as just silicon; therefore there is a higher thermal resistance despite the thermal pad.
