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Dear Sir / Madam,
On pages 44-46 of the PDF there is detailed a thermal pad which I assume is soldered directly to the PCB.
Looking in the Thermal data section there appears to be a Junction to board thermal resistance of 25.1 C/W and a Junction to Case (bottom) thermal resistance of 2.7 C/W
Which of these two values is associated with the copper pad under the component? It seems somewhat confusing to have both unless I have misunderstood the geometry / structure of this component since the bottom of the component IS attached to the board.
Many thanks
Richard Merriam