We have multiple occurrence of this Relay driver (TPIC6A595) failure.
EOS was observed in a common area after undergoing FA.
Would TI be willing to elaborate on the failure?
- Which pin on the TPIC was over stressed? The EOS is new Pin5 and Pin6 which are PGND but almost the entire circuit is between them?
- Application circuit is the same with recommended application based from datasheet. And from my analysis our application didn't reach maximum ratings, please help with this.
- Anything else that would help us understand the excessive stresses this component experienced?
We want to know the true root cause and corrective action regarding this matter.
I can send application circuit and FA findings, but not willing to post on a public forum.
Regards,
Rhed
