Hi,
When will the datasheet for TLV758P have the graphs for the thermal dissipation limits? We would like to know the impact of the copper area pour/number of layers on the thermal limits.
The datasheet TLV758P has had a placeholder image for thermal characteristics since April.
Thank you
Hi Brian,
Additional information including the Typical Characteristics curves will be added when the LDO fully releases and is updated to Active status. We are expecting this to occur by the first quarter of 2019.
The Advanced Information datasheet already contains our standard Thermal Information table. These metrics are modeled on the JEDEC Hi-k board in order to standardize the metrics across all TI datasheets in order to facilitate device to device comparisons.
The primary heatsink for an LDO is the PCB board itself and in particular the GND plane. Although specific board layout (defined by the application) will impact the thermal performance of all ICs, in order to maximize your application's thermal performance, you need to maximize the GND copper connected to the thermal pad of the LDO. By maximizing copper it is possible to achieve a 20-50% thermal performance over the JEDEC hi-k board.
Very Respectfully,
Ryan
