1. Why is the temperature item so different? Please explain why?
2. Why does the TPS62090RGTR increase in thermal resistance? Is there any change in chip material?
| TPS62090RGTR | TPS62090QRGTRQ1 | |
| temperature | -40 to 85 | -40 to 125 |
| V(ESD) Human body model (HBM) |
±2000V | ±2500 |
| V(ESD) Charged device model (CDM) |
±500V | ±1500 |
| RθJA （Junction-to-ambient thermal resistance） |
47°C/W | 45.6°C/W |
| RθJCtop （Junction-to-case (top) thermal resistance） |
60°C/W | 58.9°C/W |
| RθJB （Junction-to-board thermal resistance） |
20°C/W | 19°C/W |
| ψJT （Junction-to-top characterization parameter） |
1.5°C/W | 1.1°C/W |
| ψJB （ Junction-to-board characterization parameter） |
20°C/W | 19°C/W |
| RθJCbot （ Junction-to-case (bottom) thermal resistance） |
5.3°C/W | 4°C/W |
