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TLV733P-Q1: TLV73312PQDBVRQ1 thermal issue

Amelie Zheng
Genius 10865 points
Part Number: TLV733P-Q1

Hi Team,

Whether TLV73312PQDBVRQ1 could work normally in the following application?

  • Vin 5V
  • Vout 1.2V
  • Iout 200mA
  • Temp -40-85℃

Power=(5-1.2)*0.2=0.76W

0.76W*198.3=150℃>125℃. It is too high...How could it work normally?

  • 0
    TI__Mastermind 44600 points

    HI Amelie,

    For Any LDO, the SOT-23 package is not able to dissipate a lot of power. There is no power pad to help remove heat off of the die. If you switch to the DRV package, it will work better in the application you describe. Why better is because if the application can be as high as 85C, 0.76W*92.5 is 70.3 which when added to 85 is 155.3.  

    What can help is if Vin can be changed to 3.3V, then we have (3.3-1.2)*0.2= 0.42W so with the DRV package the thermal rise would only be 38.85 above the maximum 85C ambient for a maximum of 123.85 degrees. While this seems marginal the TJA numbers above are based on a JEDEC standard High-K board. The following application note shows how a proper layout can improve thermal metrics. Note, this only applies to packages with power pads as increasing Copper under a SOT-23 package has very little benefit.

    I hope this helps.