Other Parts Discussed in Thread: TPS61158, , TPS61161, TPS61160
The datasheet for the TPS61165DRV shows a thermal resistance junction/board of 140.2°C/W, which seems too high. It is higher than its own junction-to-case and junction-to-air. It is also high when compared to other WSON packages in the same family:
| Device | RθJA | RθJC(top) | RθJB | ψJT | ψJB | RθJC(bot) |
| TPS61158 | 70.4 | 94.8 | 39.8 | 2.5 | 40.2 | 10.2 |
| TPS61165 | 80.7 | 55.4 | 140.2 | 0.3 | 36.5 | 0.9 |
| TPS61161 | 96.1 | 89 | 65.9 | 3.2 | 66.3 | 40.8 |
| TPS61160 | 96.1 | 89 | 65.9 | 3.2 | 66.3 | 40.8 |
Can you please confirm whether the information in the datasheet is correct?
Thank you!
