Hi team,
Is thermal pad of HVSSOP package separated/floating from any pins (1~8)? UCC27424QDGNRQ1 is a device with HVSSOP package.
Regards,
Ochi
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Hi team,
Is thermal pad of HVSSOP package separated/floating from any pins (1~8)? UCC27424QDGNRQ1 is a device with HVSSOP package.
Regards,
Ochi
Hello Ochi-san,
Please refer to section 11.3 of the datasheet where we mention that the exposed pads from the package are not directly connected to any leads of the package, however, it is electrically and thermally connected to the substrate of the device which is the ground of the device.
You may externally connect the exposed pads to GND in the PCB layout for better thermal performance.
Regards,
-Mamadou
Hi Mamadou,
Thank you for your instruction. Do you mean exposed thermal pads from the package is internally connected to GND pin via the substrate?
Regards,
Ochi
Hi, Ochi-san,
You are correct. The connection is a weak connection and has variable resistance. It is not intended as an electrical connection, but we highly recommend tying it to ground to reduce noise, and improve thermal performance as Mamadou previously mentioned.
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Hi Mamadou and Don,
Thanks a lot! I will understood and I will check that training resources.
Regards,
Ochi