UCC27424-Q1: Is thermal pad of HVSSOP package separated from any pins?

Yoshiki Ochi

Part Number: UCC27424-Q1

Hi team,

Is thermal pad of HVSSOP package separated/floating from any pins (1~8)? UCC27424QDGNRQ1 is a device with HVSSOP package.

Regards,
Ochi

over 4 years ago

0 Mamadou Diallo over 4 years ago

TI__Genius 13445 points

Hello Ochi-san,

Please refer to section 11.3 of the datasheet where we mention that the exposed pads from the package are not directly connected to any leads of the package, however, it is electrically and thermally connected to the substrate of the device which is the ground of the device.

You may externally connect the exposed pads to GND in the PCB layout for better thermal performance.

Regards,

-Mamadou

0 Yoshiki Ochi over 4 years ago in reply to Mamadou Diallo

TI__Expert 7875 points

Hi Mamadou,

Thank you for your instruction. Do you mean exposed thermal pads from the package is internally connected to GND pin via the substrate?

Regards,
Ochi

0 Don Dapkus over 4 years ago in reply to Yoshiki Ochi

TI__Guru**** 189399 points

Hi, Ochi-san,

You are correct. The connection is a weak connection and has variable resistance. It is not intended as an electrical connection, but we highly recommend tying it to ground to reduce noise, and improve thermal performance as Mamadou previously mentioned.

If this answered your question, please press the Green button.

0 Yoshiki Ochi over 4 years ago in reply to Don Dapkus

TI__Expert 7875 points

Hi Mamadou and Don,

Thanks a lot! I will understood and I will check that training resources.

Regards,
Ochi

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UCC27424-Q1: Is thermal pad of HVSSOP package separated from any pins?