Hi,
At present, it is found that the IC is easy to be damaged during testing and needs help analysis.
IC usually damaged for pins HS and HB, they will have low impedance occurs during the measurement of high-side and low-side MOSFETs (use 5 * 6 MOSFETs and lift them for testing).
How can I prevent this damage?
The test location as the green area
Best Regards
Rock Shao