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CSD17483F4: CSD17483F4

Part Number: CSD17483F4

To whom it may concern,

 

We are in the process of a conformal coating validation protocol in which this component is part of the PCBA.

 

We are interested in knowing if there is any potential of component damage (Cracking, Chipping, Breaking) from exposure to fumes, vapors or any conformal coating chemistry.

We noticed that the component is made up of a crystal / glass type of substance, not sure exactly what the material is?

Concern in that since the material is crystal/glass in nature too much conformal coating can cause it to crack. Or if there is a pre-existing micro crack, can exposure to fumes, vapors or conformal coating cause these areas to continue to crack?

 

All and any details on this would be greatly appreciated.

  • Hi Raul,

    Thanks for your interest in TI FETs. This is a chip scale device and there is no plastic package. I will consult with our packaging team to get answers to your questions. As soon as I have more information, I will post a follow up response.

  • Hi Raul,

    Below is the feedback from the packaging team. Please review and let me know if you have any additional questions.

    The material base in doped Si (ceramic/glass)
    plated with Ni and Au.

    TI doesn’t provide recommendation of conformal coating
    since there are many different material in the market
    and various ways to apply the material that is not
    under TI control.

    When customer has to use conformal coating due to
    application reason, we will suggest customer has to
    select a material with low CTE. We have received
    other customers feedback that sometimes the
    coating material lifted the package result in
    open or tomb stoning.  

  • Hello John,

    Thank you for the response...

    I completely understand that there are no recommendations for  an actual conformal coating material.

    We were just wondering if there any known susceptibility for damage (cracking. chipping, etc.) or reports from others concerning this type of damage. Mainly from either direct exposure of coating material or from fumes, vapors from the solvents in coating materials. Possibly micro cracks in the material base can exacerbate with/after exposure as well?   

    Thanks again and stay safe....

    Regards

    Raul

  • Hi Raul,

    I checked with our SMT expert and TI has not run any evaluation with conformal coating. Therefore, we don't have any data to share with you.  I am not aware of other customers reporting any issues with this, either. We have seen some issues with cracking and chipping devices due to handling or during pick and place.

    We have only one case of customer feedback about damage to component. It was due to wrong size of pick and place nozzle. The nozzle should not exceed 75% of the dimension of the shorter side of the package. In this case, the package shorter side is 0.6mm. So the nozzle size should not exceed 0.45mm.

    The link below is to the FemtoFET surface mount guidelines.

  • Hello John,

    Thank you for the link to the SMT guidelines. I will review.

    Thanks

    Raul

  • Hi Raul,

    I am going to close out this thread. Feel free to contact us again if you have any additional issues.