CSD95496QVM: Do we have the CSD95496QVM Junction to Ambient Thermal ResistanceθJA(℃/W)?

Hi Jason,

Since junction to ambient thermal impedance is rarely used for application purpose, we use junction to board thermal impedance (3.5 degreeC/W) which is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in, 0.06-in (1.52-mm) thick FR4 board based on hottest board temperature within 1 mm of the package. The junction to board thermal impedance may affected by the PCB design, it could be smaller with larger board area and heavier copper.

Best,

Qingquan