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TPS82085: Land pattern recommendations

Franz Schellhase
Expert 3605 points
Part Number: TPS82085
Other Parts Discussed in Thread: TPS735,

Hi team,

A customer is working on implementing TPS82085 and TPS735 and is now looking at land patterns. There they found a discrepancy of recommendations between the two. Can you comment on why there are different recommendations for the 2 devices?

TPS82085: land pattern = SOLDER MASK DEFINED (lt. Datenblatt 10.1 „For best manufacturing results…“)

TPS735: land pattern = NON SOLDER MASK DEFINED (PREFERRED)

Thank you,

Franz

  • 0
    TI__Guru*** 142910 points

    Hi Franz,

    Since the TPS82085 D/S explains why SMD pads are recommended, let me assign this thread to the LDO team to explain why NSMD pads are recommended for their device.

    In the past, packaging has defaulted to NSMD pads for the package drawings, so it might be that no one pointed out that the LDO is also a power device which needs large copper planes to remove the heat.

  • 0 in reply to Chris Glaser
    TI__Genius 13085 points

    Hey Franz,

    Yes this appears to be the default from packaging for the mechanical drawings but I agree with Chris, the more metal you can connect to the device the better thermal dissipation it will have.