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LM5116: PMIC failure - SW pin ringing above 100V as load current increases

Part Number: LM5116

Dear All,

I've designed a 12V, 1.5A LM5116-based DC-DC converter that needs to operate at Vin = 85V. 

During testing, at 85Vin the LM5116 IC fails at currents >800mA. No other devices (MOSFETs etc) have failed yet, just the PMIC.

I measured the switch node at the MOSFETs (see measurement technique in photos), and the ringing does not appear to exceed 100V. But when measuring the switch node at the SW pin of the LM5116, at 600mA, the ringing is starting to exceed 100V. This is what I think is the current cause of failure.

If you look at the oscilloscope screenshot, the green line is the switch node at the MOSFETs, and the white line is the SW pin of the LM5116.

I've tried to design the layout as recommended by TI application notes and online resources, such as:

- Placing input capacitors as close as possible to the MOSFETs.

- Placing input capacitors as close as possible to the VIN pin on the LM5116

- Reducing the main power loop area as much as possible, HS MOSFET -> LS MOSFET -> CIN

- Large copper pours for lower resistance and better thermal performance.

One thing I believe could be improved in the next design revision is minimizing the loop area of the high-side gate drive loop, as the HO gate and SW traces are relatively long (~1.5 inches), and are are only 0.254mm / 0.01" thick.

So, here are my questions:

1) Do you think ringing on the SW pin is what is causing the failures? The peak voltage of the ringing increases as output current increases.

2) Do you think the poor layout of the high-side gate drive loop could be responsible?

3) What else could I try to achieve a higher output current without failure? Snubbers? Extra capacitance?

Attached is my filled out LM5116 quick-start design spreadsheet, and a PDF that contains the schematic, a 3D view of the layout and an image of each layer.

Thank you in advance for taking the time to look at my design.

Any help and advice would be greatly appreciated!

LM5116_HELP.docx

LM5116_DESIGN.xls

  • HI Benjamin,

    The selected MOSFET is not suitable as it has a very high Qrr, likley contributing to ringing. Also, the DPAK package is now old technology with high parasitic inductance and large package not favorable to a tight layout. Please use 3 x 3mm or 5 x 6mm FETs such as the CSD19537Q3A or similar.

    See app note snva803 for recommended power stage layout. Keeping the switching power loop area small is imperative. The cap at the IC's VIN pin is just for decoupling (100-470nF is typical), but you can add a resistor such as 2.2 Ohms in series for some RC filtering.

    Also, please ensure the input filter is adequately damped as the input voltage may overshoot if a step is applied. An electrolytic cap that provides parallel damping is useful from this standpoint.

    Regards,

    Tim

  • Hi Tim,

    Thank you for the quick response and the application note - the information provided is very helpful and I'll use it for the next design revision.

    The MOSFET you linked to (CSD19537Q3A) actually has a very similar Qrr to the MOSFET used in my design, 140nC vs 134nC.

    After a quick search I've found the SI7454DDP-T1-GE3, which has a small 5x6mm footprint, and a much lower Qrr value of 28nC. 

    Do you think this MOSFET will help with the switch node ringing, or are there other MOSFET parameters that I need to take into account? 

    Many thanks,

    Ben

  • That MOSFET should be fine. Slightly high Rdson is no problem as the load current spec is only 1.5A.

    It will be quieter and allow a tighter layout to minimize overshoot. You can also (1) add a gate (or boot) resistor on the high-side FET to slow the transition and subsequent SW voltage overshoot, or (2) add an RC snubber from SW to GND.

    --

    Tim