Other Parts Discussed in Thread: LMG5200
Hello,
can you tell me the reason behind leaving exposed copper areas in the reference design TIDUC72A that is using the LMG5200.
Thank you !
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Hello,
can you tell me the reason behind leaving exposed copper areas in the reference design TIDUC72A that is using the LMG5200.
Thank you !
Hello Catalin,
Would you mind taking a screenshot of the exposed copper area you are referring to?
Thanks!
Hi Catalin,
I see your point. Let me double check with the team and will get back to you!
Regards,
Hi Catalin,
The exposed area should be left for attaching heatsink and for thermal dissipation. Please let us know if you have further questions!
Regards,
Yichi
Hi Yichi,
I thought it was for increasing the copper thickness exteranlly during e.g. reflow, but I found it strage that the Vin and GND exposed parts where not all the way to the input connector, as it in Vout.
That solves my question.
Best regards,
Catalin