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TLV62565: Weight bearing for TLV62565DBVR packaging

Feng bin Su
Expert 7830 points
Part Number: TLV62565
Other Parts Discussed in Thread: TPS62825

Hi team,

My customer would like to add a thermal pad on the TLV62565DBVR to heat dissipation.
So, they need to know the weight bearing of the IC. I couldn't find it at Quality, reliability data. Please kindly help. Thanks.


  • 0
    TI__Expert 7585 points

    Hi User,

    Thank you for your question.

    I will check internally and let you know by tomorrow.

    Thanks,

    Stefano

    All information in this correspondence and in any related correspondence is provided “as is” and “with all faults”, and is subject to TI’s Important Notice (http://www.ti.com/corp/docs/legal/important-notice.shtml).

  • 0
    TI__Expert 7585 points

    Hi User,

    Thanks again for your question.

    TI doesn't usually provide official data of the maximum weight that the IC can bear.

    One reason is that, even if the package doesn't crack due to the push down force, an additional mass on top of the IC increases both the impact of vibrations and the mechanical stress on solder joint connection. This could potentially impact the PCB reliability.

    Therefore, we don't advise to connect the heatsink directly to the top of the device. A possible alternative could be to mount a heatsink connected to the PCB and attaching top side of the package with thermal material.

    If the customer has strict constraints on the device temperature, I would advise to opt for a device with higher current capabilities / lower FET on resistance (TPS62825 could be a good option, if compliant with the customer specs). 

    Please ask again if you need further support. 

    Thanks,

    Stefano

    All information in this correspondence and in any related correspondence is provided “as is” and “with all faults”, and is subject to TI’s Important Notice (http://www.ti.com/corp/docs/legal/important-notice.shtml).