In the case of TPS6106YFFR, it is classified as a homogeneous substance into three types of back side coating, semiconductor, and solder bump, and it is known that only the corresponding component analysis is provided.
Although the substrate is a lead frame, in the case of the DSBGA (=WLCSP) PKG type, the barrier metal UBM and the passivation PI are also classified into detailed homogeneous materials.
Therefore, TI asks you to confirm whether these two UBM and PI are included in the semiconductor and classified as homogeneous substances.
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